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BDN15-3CB/A01

Manufacturers: CTS Thermal Management Products
Product Category: Thermal - Heat Sinks
Data Sheet: BDN15-3CB/A01
Description: HEATSINK CPU W/ADHESIVE 1.51"SQ
RoHS status: RoHS Compliant
Attribute Attribute Value
Manufacturer CTS Thermal Management Products
Product Category Thermal - Heat Sinks
Type Top Mount
Shape Square, Pin Fins
Width 1.510" (38.35mm)
Length 1.510" (38.35mm)
Series BDN
Diameter -
Material Aluminum
Part Status Active
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Attachment Method Thermal Tape, Adhesive (Included)
Thermal Resistance @ Natural 15.10°C/W
Height Off Base (Height of Fin) 0.355" (9.02mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 400 LFM
New and Original electronic components BDN15-3CB/A01 from Huge inventory, fast shipment, Lanka Micro electronics website accept order online、BOM list quotation, and accept various payment term. Right now register as our member,you can get lots of discounts. For any inquiry, welcome to send email to us, or leave a message. lanka micro cooperation

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In Stock 86 pcs

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