Image is for reference only , details as Specifications
BGA0034-S
| Manufacturers: | Chip Quik, Inc. |
|---|---|
| Product Category: | Solder Stencils, Templates |
| Data Sheet: | BGA0034-S |
| Description: | BGA-676 (1.0 MM PITCH, 26 X 26 G |
| RoHS status: | RoHS Compliant |
| Attribute | Attribute Value |
|---|---|
| Manufacturer | Chip Quik, Inc. |
| Product Category | Solder Stencils, Templates |
| Type | BGA |
| Pitch | 0.039" (1.00mm) |
| Series | Proto-Advantage BGA |
| Material | Stainless Steel |
| Thickness | 0.0040" (0.102mm) |
| Part Status | Active |
| Inner Dimension | 1.024" L x 1.024" W (26.00mm x 26.00mm) |
| Outer Dimension | 2.600" L x 1.800" W (66.04mm x 45.72mm) |
| Thermal Center Pad | - |
| Number of Positions | 676 |
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In Stock 10 pcs
| Refrence Price ($) | 1 pcs | 100 pcs | 500 pcs |
|---|---|---|---|
| $20.99 | $20.57 | $20.16 |
Minimum: 1
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