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558-10-357M19-001104

Manufacturers: Preci-Dip
Product Category: Sockets for ICs, Transistors
Data Sheet: 558-10-357M19-001104
Description: BGA SURFACE MOUNT 1.27MM
RoHS status: RoHS Compliant
Attribute Attribute Value
Manufacturer Preci-Dip
Product Category Sockets for ICs, Transistors
Type BGA
Series 558
Features Closed Frame
Packaging Bulk
Part Status Active
Termination Solder
Pitch - Post 0.050" (1.27mm)
Mounting Type Surface Mount
Pitch - Mating 0.050" (1.27mm)
Contact Resistance 10mOhm
Dielectric Material FR4 Epoxy Glass
Contact Finish - Post Gold
Current Rating (Amps) 1A
Operating Temperature -55°C ~ 125°C
Contact Finish - Mating Gold
Contact Material - Post Brass
Termination Post Length 0.086" (2.20mm)
Contact Material - Mating Brass
Material Flammability Rating UL94 V-0
Contact Finish Thickness - Post 10.0µin (0.25µm)
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Number of Positions or Pins (Grid) 357 (19 x 19)
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In Stock 65 pcs

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